TWI819353B

An electrode shield structure for fan-out panel level packaging electroplating is applied to an electrode plate for electroplating processing. The electrode plate is used for the placement of an object to be plated. The electrode shield structure comprises a shield body and at least one mounting par...

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1. Verfasser:	YAN, ZHEN-YI
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator	YAN, ZHEN-YI
description	An electrode shield structure for fan-out panel level packaging electroplating is applied to an electrode plate for electroplating processing. The electrode plate is used for the placement of an object to be plated. The electrode shield structure comprises a shield body and at least one mounting part. The surface of the shield body has a plurality of through holes for shielding the electroplating solution from jet flowing and allowing a part of the electroplating solution jet flow to flow to the surface of the plated object through the through holes. The mounting part is arranged on one side of the shield body to mount the shield body on at least one side of the electrode plate. In this way, the electroplating solution jet-flow can first pass through the through holes and form a diversion and guidance effect through the through hole, so that the jet flow of the electroplating solution, namely the cations (such as copper, nickel, gold, tin ions), can flow to the metal surface of the plated object evenly, stabl
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The surface of the shield body has a plurality of through holes for shielding the electroplating solution from jet flowing and allowing a part of the electroplating solution jet flow to flow to the surface of the plated object through the through holes. The mounting part is arranged on one side of the shield body to mount the shield body on at least one side of the electrode plate. In this way, the electroplating solution jet-flow can first pass through the through holes and form a diversion and guidance effect through the through hole, so that the jet flow of the electroplating solution, namely the cations (such as copper, nickel, gold, tin ions), can flow to the metal surface of the plated object evenly, stabl</description><language>chi</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231021&DB=EPODOC&CC=TW&NR=I819353B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231021&DB=EPODOC&CC=TW&NR=I819353B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAN, ZHEN-YI</creatorcontrib><title>TWI819353B</title><description>An electrode shield structure for fan-out panel level packaging electroplating is applied to an electrode plate for electroplating processing. 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In this way, the electroplating solution jet-flow can first pass through the through holes and form a diversion and guidance effect through the through hole, so that the jet flow of the electroplating solution, namely the cations (such as copper, nickel, gold, tin ions), can flow to the metal surface of the plated object evenly, stabl</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MLQ0NjV24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAC8obiA</recordid><startdate>20231021</startdate><enddate>20231021</enddate><creator>YAN, ZHEN-YI</creator><scope>EVB</scope></search><sort><creationdate>20231021</creationdate><title>TWI819353B</title><author>YAN, ZHEN-YI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI819353BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAN, ZHEN-YI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAN, ZHEN-YI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI819353B</title><date>2023-10-21</date><risdate>2023</risdate><abstract>An electrode shield structure for fan-out panel level packaging electroplating is applied to an electrode plate for electroplating processing. The electrode plate is used for the placement of an object to be plated. The electrode shield structure comprises a shield body and at least one mounting part. The surface of the shield body has a plurality of through holes for shielding the electroplating solution from jet flowing and allowing a part of the electroplating solution jet flow to flow to the surface of the plated object through the through holes. The mounting part is arranged on one side of the shield body to mount the shield body on at least one side of the electrode plate. In this way, the electroplating solution jet-flow can first pass through the through holes and form a diversion and guidance effect through the through hole, so that the jet flow of the electroplating solution, namely the cations (such as copper, nickel, gold, tin ions), can flow to the metal surface of the plated object evenly, stabl</abstract><oa>free_for_read</oa></addata></record>
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subjects	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title	TWI819353B
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