Heat dissipation component

Provided is a substantially rectangular flat heat dissipation member including: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIHARA, YOSUKE, GOTO, DAISUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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