TWI818883B
The present disclosure provides: a photosensitive resin multilayer body that has a photosensitive resin composition layer on a support film, the photosensitive resin composition layer being able to achieve a good balance among color developability upon exposure to light, solubility in a developer so...
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| creator | NAITO, KAZUYA MURATA, NAOHIRO MATSUDA, TAKAYUKI |
| description | The present disclosure provides: a photosensitive resin multilayer body that has a photosensitive resin composition layer on a support film, the photosensitive resin composition layer being able to achieve a good balance among color developability upon exposure to light, solubility in a developer solution (that is developability), and colorability of a base film; and a method for producing this photosensitive resin multilayer body. This photosensitive resin multilayer body is provided with: a support film; and a photosensitive resin composition layer that is formed on the support film. The photosensitive resin composition layer contains an alkali-soluble polymer, a compound that has an ethylenically unsaturated double bond, a photopolymerization initiator, and a peroxide that contains an acetone peroxide and/or methyl ethyl ketone peroxide. The content of the peroxide in the photosensitive resin composition layer is from 0.01 ppm to 1,000 ppm based on the photosensitive resin composition layer. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI818883BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI818883BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI818883BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MLSwsDB24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAD30bnQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI818883B</title><source>esp@cenet</source><creator>NAITO, KAZUYA ; MURATA, NAOHIRO ; MATSUDA, TAKAYUKI</creator><creatorcontrib>NAITO, KAZUYA ; MURATA, NAOHIRO ; MATSUDA, TAKAYUKI</creatorcontrib><description>The present disclosure provides: a photosensitive resin multilayer body that has a photosensitive resin composition layer on a support film, the photosensitive resin composition layer being able to achieve a good balance among color developability upon exposure to light, solubility in a developer solution (that is developability), and colorability of a base film; and a method for producing this photosensitive resin multilayer body. This photosensitive resin multilayer body is provided with: a support film; and a photosensitive resin composition layer that is formed on the support film. The photosensitive resin composition layer contains an alkali-soluble polymer, a compound that has an ethylenically unsaturated double bond, a photopolymerization initiator, and a peroxide that contains an acetone peroxide and/or methyl ethyl ketone peroxide. The content of the peroxide in the photosensitive resin composition layer is from 0.01 ppm to 1,000 ppm based on the photosensitive resin composition layer.</description><language>chi</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231011&DB=EPODOC&CC=TW&NR=I818883B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231011&DB=EPODOC&CC=TW&NR=I818883B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAITO, KAZUYA</creatorcontrib><creatorcontrib>MURATA, NAOHIRO</creatorcontrib><creatorcontrib>MATSUDA, TAKAYUKI</creatorcontrib><title>TWI818883B</title><description>The present disclosure provides: a photosensitive resin multilayer body that has a photosensitive resin composition layer on a support film, the photosensitive resin composition layer being able to achieve a good balance among color developability upon exposure to light, solubility in a developer solution (that is developability), and colorability of a base film; and a method for producing this photosensitive resin multilayer body. This photosensitive resin multilayer body is provided with: a support film; and a photosensitive resin composition layer that is formed on the support film. The photosensitive resin composition layer contains an alkali-soluble polymer, a compound that has an ethylenically unsaturated double bond, a photopolymerization initiator, and a peroxide that contains an acetone peroxide and/or methyl ethyl ketone peroxide. The content of the peroxide in the photosensitive resin composition layer is from 0.01 ppm to 1,000 ppm based on the photosensitive resin composition layer.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MLSwsDB24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAD30bnQ</recordid><startdate>20231011</startdate><enddate>20231011</enddate><creator>NAITO, KAZUYA</creator><creator>MURATA, NAOHIRO</creator><creator>MATSUDA, TAKAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20231011</creationdate><title>TWI818883B</title><author>NAITO, KAZUYA ; MURATA, NAOHIRO ; MATSUDA, TAKAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI818883BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAITO, KAZUYA</creatorcontrib><creatorcontrib>MURATA, NAOHIRO</creatorcontrib><creatorcontrib>MATSUDA, TAKAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAITO, KAZUYA</au><au>MURATA, NAOHIRO</au><au>MATSUDA, TAKAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI818883B</title><date>2023-10-11</date><risdate>2023</risdate><abstract>The present disclosure provides: a photosensitive resin multilayer body that has a photosensitive resin composition layer on a support film, the photosensitive resin composition layer being able to achieve a good balance among color developability upon exposure to light, solubility in a developer solution (that is developability), and colorability of a base film; and a method for producing this photosensitive resin multilayer body. This photosensitive resin multilayer body is provided with: a support film; and a photosensitive resin composition layer that is formed on the support film. The photosensitive resin composition layer contains an alkali-soluble polymer, a compound that has an ethylenically unsaturated double bond, a photopolymerization initiator, and a peroxide that contains an acetone peroxide and/or methyl ethyl ketone peroxide. The content of the peroxide in the photosensitive resin composition layer is from 0.01 ppm to 1,000 ppm based on the photosensitive resin composition layer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | TWI818883B |
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