TWI817682B

The present invention provides a protective film forming device which does not cause burden on a device and is capable of forming a smooth surface. The protective film forming device of the present invention comprises: a resin supply portion for supplying liquid curing resin onto a surface carrying...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: NISHIGAKI, HISASHI
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:The present invention provides a protective film forming device which does not cause burden on a device and is capable of forming a smooth surface. The protective film forming device of the present invention comprises: a resin supply portion for supplying liquid curing resin onto a surface carrying a device; a substrate holding portion for holding a substrate supplied with a curing resin; a support portion disposed opposite to the substrate holding portion; a tape supply portion for supplying the anti-adhesion tape between the substrate holding portion and the support portion; a pressing portion for pressing the substrate toward the support portion to press the curing resin supplied onto the substrate against the anti-adhesion tape for stretching the curing resin on the substrate; a curing portion for curing the curing resin stretched on the substrate; and an abutting portion for pressing the substrate by the pressing portion. When the substrate holding portion abuts against the support portion, a predetermin