PACKAGE STRUCTURES

A package structure is provided. The package structure includes a leadframe, a GaN power device, and an electrostatic discharge protection component. The leadframe includes a gate pad, a source pad, and a drain pad, which are disposed on the leadframe. The GaN power device has a gate end. The GaN po...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI, JENIH, CHAO, WEI-HSIANG, WANG, LIANGNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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