Package structure and method of forming the same

A package structure is provided, including a substrate, a first passivation layer, a metallization layer, a second passivation layer, and a polymer layer. The first passivation layer is formed over the substrate. The metallization layer is conformally formed on the first passivation layer. The secon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, RUNG-DE, CHEN, KAI-HENG, TSAO, PEI-HAW, LEU, SHYUE-TER, WANG, CHIENUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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