Dual-sided molding for encapsulating electronic devices

A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section cover...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANGELITO BARROZO, PEREZ, LIN, YI, YAN, KAR WENG, KUAH, TENG HOCK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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