TWI811338B
A cutting apparatus includes a cutting dust collection box that collects cutting dust and a cutting dust guide plate that is disposed on the downstream side in a processing feed direction relative to a chuck table and receives cutting water and the cutting dust that flow to the downstream side after...
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| creator | UEYAMA, HIROMITSU KATOH, KEI |
| description | A cutting apparatus includes a cutting dust collection box that collects cutting dust and a cutting dust guide plate that is disposed on the downstream side in a processing feed direction relative to a chuck table and receives cutting water and the cutting dust that flow to the downstream side after cutting to guide the cutting water and the cutting dust to the cutting dust collection box. A cutting dust breaking unit that breaks the cutting dust into small pieces is disposed at a position onto which the cutting dust that flows from a plate-shaped cover drops over the cutting dust guide plate. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI811338BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI811338BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI811338BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfe0MDQ0NrZw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACO0beQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI811338B</title><source>esp@cenet</source><creator>UEYAMA, HIROMITSU ; KATOH, KEI</creator><creatorcontrib>UEYAMA, HIROMITSU ; KATOH, KEI</creatorcontrib><description>A cutting apparatus includes a cutting dust collection box that collects cutting dust and a cutting dust guide plate that is disposed on the downstream side in a processing feed direction relative to a chuck table and receives cutting water and the cutting dust that flow to the downstream side after cutting to guide the cutting water and the cutting dust to the cutting dust collection box. A cutting dust breaking unit that breaks the cutting dust into small pieces is disposed at a position onto which the cutting dust that flows from a plate-shaped cover drops over the cutting dust guide plate.</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230811&DB=EPODOC&CC=TW&NR=I811338B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230811&DB=EPODOC&CC=TW&NR=I811338B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEYAMA, HIROMITSU</creatorcontrib><creatorcontrib>KATOH, KEI</creatorcontrib><title>TWI811338B</title><description>A cutting apparatus includes a cutting dust collection box that collects cutting dust and a cutting dust guide plate that is disposed on the downstream side in a processing feed direction relative to a chuck table and receives cutting water and the cutting dust that flow to the downstream side after cutting to guide the cutting water and the cutting dust to the cutting dust collection box. A cutting dust breaking unit that breaks the cutting dust into small pieces is disposed at a position onto which the cutting dust that flows from a plate-shaped cover drops over the cutting dust guide plate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</subject><subject>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINE TOOLS</subject><subject>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDQ0NrZw4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACO0beQ</recordid><startdate>20230811</startdate><enddate>20230811</enddate><creator>UEYAMA, HIROMITSU</creator><creator>KATOH, KEI</creator><scope>EVB</scope></search><sort><creationdate>20230811</creationdate><title>TWI811338B</title><author>UEYAMA, HIROMITSU ; KATOH, KEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI811338BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</topic><topic>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINE TOOLS</topic><topic>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>UEYAMA, HIROMITSU</creatorcontrib><creatorcontrib>KATOH, KEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEYAMA, HIROMITSU</au><au>KATOH, KEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI811338B</title><date>2023-08-11</date><risdate>2023</risdate><abstract>A cutting apparatus includes a cutting dust collection box that collects cutting dust and a cutting dust guide plate that is disposed on the downstream side in a processing feed direction relative to a chuck table and receives cutting water and the cutting dust that flow to the downstream side after cutting to guide the cutting water and the cutting dust to the cutting dust collection box. A cutting dust breaking unit that breaks the cutting dust into small pieces is disposed at a position onto which the cutting dust that flows from a plate-shaped cover drops over the cutting dust guide plate.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi |
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| subjects | BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | TWI811338B |
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