Method, system and integrated circuit for provisioning an electronic device

A method for provisioning an electronic device includes providing a semiconductor wafer on which multiple integrated circuit (IC) chips have been fabricated. Each chip includes a secure memory and programmable logic, which is configured to store at least two keys in the secure memory and to compute...

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Hauptverfasser:	TANAMI, OREN, MORAV, DAN, HERSHMAN, ZIV
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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creator	TANAMI, OREN MORAV, DAN HERSHMAN, ZIV
description	A method for provisioning an electronic device includes providing a semiconductor wafer on which multiple integrated circuit (IC) chips have been fabricated. Each chip includes a secure memory and programmable logic, which is configured to store at least two keys in the secure memory and to compute digital signatures over data using the at least two keys. A respective first key is provisioned into the secure memory of each of the chips via electrical probes applied to contact pads on the semiconductor wafer. After dicing of the wafer, a respective second key is provisioned into the secure memory of each of the chips via contact pins of the chips. A respective provisioning report is received from each of the chips with a digital signature computed by the logic using both of the respective first and second keys. The provisioning is verified based on the digital signature.
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language	chi ; eng
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subjects	CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
title	Method, system and integrated circuit for provisioning an electronic device
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