TWI804680B
Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having...
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| creator | KOYANAGI, HIDEYUKI KANDA, RYOSUKE KAWAKUSU, TETSUO |
| description | Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure. |
| format | Patent |
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| language | chi |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | TWI804680B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-30T19%3A49%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOYANAGI,%20HIDEYUKI&rft.date=2023-06-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI804680BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |