Semiconductor inspecting method for ensuring scrubbing length on pad

Semiconductor inspecting method for ensuring scrubbing length on pad

A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a rela...

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Hauptverfasser: FEHRMANN, FRANK, CHEN, CHIEN-HUNG, GIESSMANN, SEBASTIAN, HANSEL, VOLKER
Format: Patent
Sprache:chi ; eng
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MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator FEHRMANN, FRANK
CHEN, CHIEN-HUNG
GIESSMANN, SEBASTIAN
HANSEL, VOLKER
description A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Semiconductor inspecting method for ensuring scrubbing length on pad
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