Printed circuit board and camera module having the same

According to an aspect of the present invention, a printed circuit board includes a first substrate; a cavity penetrating from one surface to the other surface of the first substrate; and a first reinforcing member attached to the other surface of the first substrate and covering the cavity. The fir...

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Bibliographische Detailangaben
Hauptverfasser:	KOO, BONG-WAN, PARK, YOUNG-PO, KIM, BEOM-JUN, KIM, JEE-HOON, LEE, YONG-JIK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to an aspect of the present invention, a printed circuit board includes a first substrate; a cavity penetrating from one surface to the other surface of the first substrate; and a first reinforcing member attached to the other surface of the first substrate and covering the cavity. The first reinforcing member may have a hole which not overlaps with the cavity. It is possible to control warpage at a reflow process.