TWI789483B
A photocurable resin composition according to the present invention contains an anionic-group-containing photosensitive resin comprising a photosensitive urethane resin, a photopolymerization initiator and a thermal curing agent, wherein the photosensitive urethane resin is produced by reacting a ra...
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creator | GONDAIRA, TAKASHI TAI, MAKOTO |
description | A photocurable resin composition according to the present invention contains an anionic-group-containing photosensitive resin comprising a photosensitive urethane resin, a photopolymerization initiator and a thermal curing agent, wherein the photosensitive urethane resin is produced by reacting a raw material mixture containing (A) a polyol having at least an ester bond and also having an unsaturated bond at least in the main chain thereof, (B) a compound having at least one active-hydrogen-containing group and at least one anionic group in the molecule thereof, (C) a polyisocyanate and (D) a compound having at least one active-hydrogen-containing group and an unsaturated bond group in the molecule thereof, and the photosensitive urethane resin has an ester bond and an unsaturated bond in the main chain in the same molecule, wherein at least one of a side chain and a terminal has an anionic group and a side chain has an unsaturated bond group. |
format | Patent |
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AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; 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subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
title | TWI789483B |
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