Method of manufacturing a 3d semiconductor wafer

A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OR-BACH, ZVI, SEKAR, DEEPAK C, CRONQUIST, BRIAN, BEINGLASS, ISRAEL, DE JONG, J. L, WURMAN, ZEEV
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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