TWI787471B

An objective of the present invention is to prevent grinding water including ground fragments from infiltrating into a gap between neighboring chips even if a workpiece is formed in a finishing thickness. A method for machining a workpiece comprises: a surface protection step of covering an upper su...

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Bibliographische Detailangaben

1. Verfasser:	AGARI, MASAMITSU
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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