FLUX AND SOLDER PASTE

FLUX AND SOLDER PASTE

A flux comprising a base resin, an activator, a thixotropic agent, a solvent, and a solder bonding defect inhibitor, wherein: the solder bonding defect inhibitor is a copolymer including a structural unit represented by formula (1) and a structural unit represented by formula (2); the weight average...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAGAI, TOMOKO, ASAMI, AI, TAKAGI, KAZUYORI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:A flux comprising a base resin, an activator, a thixotropic agent, a solvent, and a solder bonding defect inhibitor, wherein: the solder bonding defect inhibitor is a copolymer including a structural unit represented by formula (1) and a structural unit represented by formula (2); the weight average molecular weight of the copolymer is 1000-100000; the amount of the solder bonding defect inhibitor with respect to the entirety of the flux is 1-25 mass%; in formula (1), R1 represents a straight chain, branched chain, or cyclic alkyl group that is saturated or unsaturated and has 1-24 carbon atoms, or a substituted or unsubstituted aryl group; in formula (2), R2 represents a group represented by formula (2-1); and, in formula (2-1), n represents an integer of 1-30, R21 represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, and R22 represents a straight chain, branched chain, or cyclic alkylene group having 1-6 carbon atoms.