TWI784792B
A heat pipe includes a container having an internal space for a working fluid, and an evaporating portion that evaporates a liquid-phase working fluid to change it into a gas-phase working fluid. A condensing portion separated from the evaporating portion condenses a gas-phase working fluid to chang...
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| creator | UEKUBO, MASAHIRO |
| description | A heat pipe includes a container having an internal space for a working fluid, and an evaporating portion that evaporates a liquid-phase working fluid to change it into a gas-phase working fluid. A condensing portion separated from the evaporating portion condenses a gas-phase working fluid to change it into a liquid-phase working fluid, and an intermediate portion located between the evaporating portion condensing portion. The heat pipe includes a first sintered body layer on an inner peripheral surface of the evaporating portion and includes a product of sintering a first copper powder. A second sintered body layer continuously extends to at least a part of an inner peripheral surface of the intermediate portion and stacked on an inner peripheral surface of the first sintered body layer and includes a product of sintering of a second copper powder having a larger average particle size than the first copper powder. |
| format | Patent |
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A condensing portion separated from the evaporating portion condenses a gas-phase working fluid to change it into a liquid-phase working fluid, and an intermediate portion located between the evaporating portion condensing portion. The heat pipe includes a first sintered body layer on an inner peripheral surface of the evaporating portion and includes a product of sintering a first copper powder. A second sintered body layer continuously extends to at least a part of an inner peripheral surface of the intermediate portion and stacked on an inner peripheral surface of the first sintered body layer and includes a product of sintering of a second copper powder having a larger average particle size than the first copper powder.</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221121&DB=EPODOC&CC=TW&NR=I784792B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221121&DB=EPODOC&CC=TW&NR=I784792B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEKUBO, MASAHIRO</creatorcontrib><title>TWI784792B</title><description>A heat pipe includes a container having an internal space for a working fluid, and an evaporating portion that evaporates a liquid-phase working fluid to change it into a gas-phase working fluid. A condensing portion separated from the evaporating portion condenses a gas-phase working fluid to change it into a liquid-phase working fluid, and an intermediate portion located between the evaporating portion condensing portion. The heat pipe includes a first sintered body layer on an inner peripheral surface of the evaporating portion and includes a product of sintering a first copper powder. A second sintered body layer continuously extends to at least a part of an inner peripheral surface of the intermediate portion and stacked on an inner peripheral surface of the first sintered body layer and includes a product of sintering of a second copper powder having a larger average particle size than the first copper powder.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0tzAxtzRy4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAEB4boA</recordid><startdate>20221121</startdate><enddate>20221121</enddate><creator>UEKUBO, MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20221121</creationdate><title>TWI784792B</title><author>UEKUBO, MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI784792BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>UEKUBO, MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEKUBO, MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI784792B</title><date>2022-11-21</date><risdate>2022</risdate><abstract>A heat pipe includes a container having an internal space for a working fluid, and an evaporating portion that evaporates a liquid-phase working fluid to change it into a gas-phase working fluid. A condensing portion separated from the evaporating portion condenses a gas-phase working fluid to change it into a liquid-phase working fluid, and an intermediate portion located between the evaporating portion condensing portion. The heat pipe includes a first sintered body layer on an inner peripheral surface of the evaporating portion and includes a product of sintering a first copper powder. A second sintered body layer continuously extends to at least a part of an inner peripheral surface of the intermediate portion and stacked on an inner peripheral surface of the first sintered body layer and includes a product of sintering of a second copper powder having a larger average particle size than the first copper powder.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | TWI784792B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T01%3A00%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UEKUBO,%20MASAHIRO&rft.date=2022-11-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI784792BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |