TWI780643B

[Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate s...

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Hauptverfasser: OTOMO, TATSUNORI, YAMASHITA, MAKOTO, KATO, YASUO, SUNAGA, SEIJIRO, MAKIDA, MITSUYOSHI, SATO, YOHEI, MIYAGOSHI, TOSHINOBU
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creator OTOMO, TATSUNORI
YAMASHITA, MAKOTO
KATO, YASUO
SUNAGA, SEIJIRO
MAKIDA, MITSUYOSHI
SATO, YOHEI
MIYAGOSHI, TOSHINOBU
description [Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.[Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title TWI780643B
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