TWI780643B
[Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate s...
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creator | OTOMO, TATSUNORI YAMASHITA, MAKOTO KATO, YASUO SUNAGA, SEIJIRO MAKIDA, MITSUYOSHI SATO, YOHEI MIYAGOSHI, TOSHINOBU |
description | [Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.[Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon. |
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YAMASHITA, MAKOTO ; KATO, YASUO ; SUNAGA, SEIJIRO ; MAKIDA, MITSUYOSHI ; SATO, YOHEI ; MIYAGOSHI, TOSHINOBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI780643BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OTOMO, TATSUNORI</creatorcontrib><creatorcontrib>YAMASHITA, MAKOTO</creatorcontrib><creatorcontrib>KATO, YASUO</creatorcontrib><creatorcontrib>SUNAGA, SEIJIRO</creatorcontrib><creatorcontrib>MAKIDA, MITSUYOSHI</creatorcontrib><creatorcontrib>SATO, YOHEI</creatorcontrib><creatorcontrib>MIYAGOSHI, TOSHINOBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTOMO, TATSUNORI</au><au>YAMASHITA, MAKOTO</au><au>KATO, YASUO</au><au>SUNAGA, SEIJIRO</au><au>MAKIDA, MITSUYOSHI</au><au>SATO, YOHEI</au><au>MIYAGOSHI, TOSHINOBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI780643B</title><date>2022-10-11</date><risdate>2022</risdate><abstract>[Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.[Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | TWI780643B |
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