FAN OUT STRUCTURE FOR LIGHT-EMITTING DIODE (LED) DEVICE AND LIGHTING SYSTEM

Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the...

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Hauptverfasser: BONNE, RONALD JOHANNES, VAIDYANATHAN, ANANTHARAMAN, BANNA, SRINI, HIN, TZE YANG
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creator BONNE, RONALD JOHANNES
VAIDYANATHAN, ANANTHARAMAN
BANNA, SRINI
HIN, TZE YANG
description Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI774130BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI774130BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI774130BB3</originalsourceid><addsrcrecordid>eNrjZPB2c_RT8A8NUQgOCQp1DgkNclVw8w9S8PF09wjRdfX1DAnx9HNXcPH0d3FV0PBxddFUcHEN83R2VXD0c4GoAskHRwaHuPryMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JL4kHBPc3MTQ2MDJydjIpQAABU9LVw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FAN OUT STRUCTURE FOR LIGHT-EMITTING DIODE (LED) DEVICE AND LIGHTING SYSTEM</title><source>esp@cenet</source><creator>BONNE, RONALD JOHANNES ; VAIDYANATHAN, ANANTHARAMAN ; BANNA, SRINI ; HIN, TZE YANG</creator><creatorcontrib>BONNE, RONALD JOHANNES ; VAIDYANATHAN, ANANTHARAMAN ; BANNA, SRINI ; HIN, TZE YANG</creatorcontrib><description>Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220811&amp;DB=EPODOC&amp;CC=TW&amp;NR=I774130B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25546,76297</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220811&amp;DB=EPODOC&amp;CC=TW&amp;NR=I774130B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BONNE, RONALD JOHANNES</creatorcontrib><creatorcontrib>VAIDYANATHAN, ANANTHARAMAN</creatorcontrib><creatorcontrib>BANNA, SRINI</creatorcontrib><creatorcontrib>HIN, TZE YANG</creatorcontrib><title>FAN OUT STRUCTURE FOR LIGHT-EMITTING DIODE (LED) DEVICE AND LIGHTING SYSTEM</title><description>Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB2c_RT8A8NUQgOCQp1DgkNclVw8w9S8PF09wjRdfX1DAnx9HNXcPH0d3FV0PBxddFUcHEN83R2VXD0c4GoAskHRwaHuPryMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JL4kHBPc3MTQ2MDJydjIpQAABU9LVw</recordid><startdate>20220811</startdate><enddate>20220811</enddate><creator>BONNE, RONALD JOHANNES</creator><creator>VAIDYANATHAN, ANANTHARAMAN</creator><creator>BANNA, SRINI</creator><creator>HIN, TZE YANG</creator><scope>EVB</scope></search><sort><creationdate>20220811</creationdate><title>FAN OUT STRUCTURE FOR LIGHT-EMITTING DIODE (LED) DEVICE AND LIGHTING SYSTEM</title><author>BONNE, RONALD JOHANNES ; VAIDYANATHAN, ANANTHARAMAN ; BANNA, SRINI ; HIN, TZE YANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI774130BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BONNE, RONALD JOHANNES</creatorcontrib><creatorcontrib>VAIDYANATHAN, ANANTHARAMAN</creatorcontrib><creatorcontrib>BANNA, SRINI</creatorcontrib><creatorcontrib>HIN, TZE YANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BONNE, RONALD JOHANNES</au><au>VAIDYANATHAN, ANANTHARAMAN</au><au>BANNA, SRINI</au><au>HIN, TZE YANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FAN OUT STRUCTURE FOR LIGHT-EMITTING DIODE (LED) DEVICE AND LIGHTING SYSTEM</title><date>2022-08-11</date><risdate>2022</risdate><abstract>Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title FAN OUT STRUCTURE FOR LIGHT-EMITTING DIODE (LED) DEVICE AND LIGHTING SYSTEM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T11%3A09%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BONNE,%20RONALD%20JOHANNES&rft.date=2022-08-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI774130BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true