INTEGRATED CIRCUIT AND METHOD FOR FORMING AN INTEGRATED CIRCUIT

Disclosed herein are related to an integrated circuit including multiple dies stacked along a direction. In one aspect, the integrated circuit includes a first die, a second die, and a third die stacked along the direction. In one aspect, the first die includes a first interface circuit to generate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU, YU-HAO, HUANG, TZEIANG, TAM, KING-HO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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