FLEXIBLE COPPER CLAD LAMINATE FILM, ARTICLE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE FLEXIBLE COPPER CLAD LAMINATE FILM
Provided are a flexible copper clad laminate film, an article including the same, and a method of manufacturing the flexible copper clad laminate film. The flexible copper clad laminate film includes: a non-conductive polymer substrate; an electroless nickel-containing plating layer located on at le...
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| creator | LEE, YONG HO JEONG, WOO DEUK LEE, JEONG DEOK LEE, JIN HEE |
| description | Provided are a flexible copper clad laminate film, an article including the same, and a method of manufacturing the flexible copper clad laminate film. The flexible copper clad laminate film includes: a non-conductive polymer substrate; an electroless nickel-containing plating layer located on at least one surface of the substrate; and a first copper plating layer located on the electroless nickel-containing plating layer, wherein a delamination rate per unit area (cm2) between the non-conductive polymer substrate and the electroless nickel-containing plating layer is 1 % or less, a total thickness of the flexible copper clad laminate film excluding the substrate is 0.1 [mu]m to 30 [mu]m, and a thickness change rate from (A) the total thickness of the flexible copper clad laminate film excluding the substrate to (B) the total thickness of the flexible copper clad laminate film excluding the substrate after the flexible copper clad laminate film has been placed and left to stand in a solder bath at 260 DEG C t |
| format | Patent |
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The flexible copper clad laminate film includes: a non-conductive polymer substrate; an electroless nickel-containing plating layer located on at least one surface of the substrate; and a first copper plating layer located on the electroless nickel-containing plating layer, wherein a delamination rate per unit area (cm2) between the non-conductive polymer substrate and the electroless nickel-containing plating layer is 1 % or less, a total thickness of the flexible copper clad laminate film excluding the substrate is 0.1 [mu]m to 30 [mu]m, and a thickness change rate from (A) the total thickness of the flexible copper clad laminate film excluding the substrate to (B) the total thickness of the flexible copper clad laminate film excluding the substrate after the flexible copper clad laminate film has been placed and left to stand in a solder bath at 260 DEG C t</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220621&DB=EPODOC&CC=TW&NR=I768802B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220621&DB=EPODOC&CC=TW&NR=I768802B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, YONG HO</creatorcontrib><creatorcontrib>JEONG, WOO DEUK</creatorcontrib><creatorcontrib>LEE, JEONG DEOK</creatorcontrib><creatorcontrib>LEE, JIN HEE</creatorcontrib><title>FLEXIBLE COPPER CLAD LAMINATE FILM, ARTICLE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE FLEXIBLE COPPER CLAD LAMINATE FILM</title><description>Provided are a flexible copper clad laminate film, an article including the same, and a method of manufacturing the flexible copper clad laminate film. The flexible copper clad laminate film includes: a non-conductive polymer substrate; an electroless nickel-containing plating layer located on at least one surface of the substrate; and a first copper plating layer located on the electroless nickel-containing plating layer, wherein a delamination rate per unit area (cm2) between the non-conductive polymer substrate and the electroless nickel-containing plating layer is 1 % or less, a total thickness of the flexible copper clad laminate film excluding the substrate is 0.1 [mu]m to 30 [mu]m, and a thickness change rate from (A) the total thickness of the flexible copper clad laminate film excluding the substrate to (B) the total thickness of the flexible copper clad laminate film excluding the substrate after the flexible copper clad laminate film has been placed and left to stand in a solder bath at 260 DEG C t</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzD0KwkAQhuFtLES9wxxAQRQ07WR31gzsT4izaBeCrJVoIJ7Ak5tCa62-4n34puplHZ25dAQ61jU1oB0acOg5oBBYdn4J2AjrkXDQLhkOB5CK4IiexhYMeJIqGogWPIZkUUtqvur3_1xNrt1tyIvPzhRYEl2tcv9o89B3l3zPz1ZOvN8VxXpTlts_yBvqcDvl</recordid><startdate>20220621</startdate><enddate>20220621</enddate><creator>LEE, YONG HO</creator><creator>JEONG, WOO DEUK</creator><creator>LEE, JEONG DEOK</creator><creator>LEE, JIN HEE</creator><scope>EVB</scope></search><sort><creationdate>20220621</creationdate><title>FLEXIBLE COPPER CLAD LAMINATE FILM, ARTICLE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE FLEXIBLE COPPER CLAD LAMINATE FILM</title><author>LEE, YONG HO ; JEONG, WOO DEUK ; LEE, JEONG DEOK ; LEE, JIN HEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI768802BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, YONG HO</creatorcontrib><creatorcontrib>JEONG, WOO DEUK</creatorcontrib><creatorcontrib>LEE, JEONG DEOK</creatorcontrib><creatorcontrib>LEE, JIN HEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, YONG HO</au><au>JEONG, WOO DEUK</au><au>LEE, JEONG DEOK</au><au>LEE, JIN HEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE COPPER CLAD LAMINATE FILM, ARTICLE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE FLEXIBLE COPPER CLAD LAMINATE FILM</title><date>2022-06-21</date><risdate>2022</risdate><abstract>Provided are a flexible copper clad laminate film, an article including the same, and a method of manufacturing the flexible copper clad laminate film. The flexible copper clad laminate film includes: a non-conductive polymer substrate; an electroless nickel-containing plating layer located on at least one surface of the substrate; and a first copper plating layer located on the electroless nickel-containing plating layer, wherein a delamination rate per unit area (cm2) between the non-conductive polymer substrate and the electroless nickel-containing plating layer is 1 % or less, a total thickness of the flexible copper clad laminate film excluding the substrate is 0.1 [mu]m to 30 [mu]m, and a thickness change rate from (A) the total thickness of the flexible copper clad laminate film excluding the substrate to (B) the total thickness of the flexible copper clad laminate film excluding the substrate after the flexible copper clad laminate film has been placed and left to stand in a solder bath at 260 DEG C t</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | FLEXIBLE COPPER CLAD LAMINATE FILM, ARTICLE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE FLEXIBLE COPPER CLAD LAMINATE FILM |
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