Chip detachment apparatus

A chip detachment apparatus provided to detach a chip from a wafer attached on a carrier includes a sleeve, a pushing mechanism, a movement limitation mechanism and a return mechanism. A positioning carrier is fixed in the sleeve and the movement limitation mechanism is movably mounted in the sleeve...

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Hauptverfasser:	LEE, WEI-TA, LEE, CHEN-TA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	LEE, WEI-TA LEE, CHEN-TA
description	A chip detachment apparatus provided to detach a chip from a wafer attached on a carrier includes a sleeve, a pushing mechanism, a movement limitation mechanism and a return mechanism. A positioning carrier is fixed in the sleeve and the movement limitation mechanism is movably mounted in the sleeve. A push member of the pushing mechanism is able to push the chip up through the movement limitation mechanism and the return mechanism so as to detach the chip from the wafer.
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language	chi ; eng
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Chip detachment apparatus
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