Package structures
A package structure is provided. The package structure includes a leadframe, a device, first protrusions, second protrusions, a conductive unit, and an encapsulation material. The device includes a substrate, an active layer, first electrodes, second electrodes and a third electrode. The first elect...
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| creator | CHIOU, SHENG LI, JENIH |
| description | A package structure is provided. The package structure includes a leadframe, a device, first protrusions, second protrusions, a conductive unit, and an encapsulation material. The device includes a substrate, an active layer, first electrodes, second electrodes and a third electrode. The first electrodes have different potentials than the second electrodes. The first electrodes and the second electrodes are arranged so that they alternate with each other. The first protrusions are disposed on each of the first electrodes. The second protrusions are disposed on each of the second electrodes. The first protrusions and the second protrusions are connected to the leadframe. The first side of the conductive unit is connected to the substrate of the device. The conductive unit is connected to the leadframe. The encapsulation material covers the device and the leadframe. The second side of the conductive unit is exposed from the encapsulation material. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI761123BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI761123BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI761123BB3</originalsourceid><addsrcrecordid>eNrjZBAKSEzOTkxPVSguKSpNLiktSi3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxIeGe5maGhkbGTk7GRCgBANicIDs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Package structures</title><source>esp@cenet</source><creator>CHIOU, SHENG ; LI, JENIH</creator><creatorcontrib>CHIOU, SHENG ; LI, JENIH</creatorcontrib><description>A package structure is provided. The package structure includes a leadframe, a device, first protrusions, second protrusions, a conductive unit, and an encapsulation material. The device includes a substrate, an active layer, first electrodes, second electrodes and a third electrode. The first electrodes have different potentials than the second electrodes. The first electrodes and the second electrodes are arranged so that they alternate with each other. The first protrusions are disposed on each of the first electrodes. The second protrusions are disposed on each of the second electrodes. The first protrusions and the second protrusions are connected to the leadframe. The first side of the conductive unit is connected to the substrate of the device. The conductive unit is connected to the leadframe. The encapsulation material covers the device and the leadframe. The second side of the conductive unit is exposed from the encapsulation material.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220411&DB=EPODOC&CC=TW&NR=I761123B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220411&DB=EPODOC&CC=TW&NR=I761123B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIOU, SHENG</creatorcontrib><creatorcontrib>LI, JENIH</creatorcontrib><title>Package structures</title><description>A package structure is provided. The package structure includes a leadframe, a device, first protrusions, second protrusions, a conductive unit, and an encapsulation material. The device includes a substrate, an active layer, first electrodes, second electrodes and a third electrode. The first electrodes have different potentials than the second electrodes. The first electrodes and the second electrodes are arranged so that they alternate with each other. The first protrusions are disposed on each of the first electrodes. The second protrusions are disposed on each of the second electrodes. The first protrusions and the second protrusions are connected to the leadframe. The first side of the conductive unit is connected to the substrate of the device. The conductive unit is connected to the leadframe. The encapsulation material covers the device and the leadframe. The second side of the conductive unit is exposed from the encapsulation material.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAKSEzOTkxPVSguKSpNLiktSi3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxIeGe5maGhkbGTk7GRCgBANicIDs</recordid><startdate>20220411</startdate><enddate>20220411</enddate><creator>CHIOU, SHENG</creator><creator>LI, JENIH</creator><scope>EVB</scope></search><sort><creationdate>20220411</creationdate><title>Package structures</title><author>CHIOU, SHENG ; LI, JENIH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI761123BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIOU, SHENG</creatorcontrib><creatorcontrib>LI, JENIH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIOU, SHENG</au><au>LI, JENIH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package structures</title><date>2022-04-11</date><risdate>2022</risdate><abstract>A package structure is provided. The package structure includes a leadframe, a device, first protrusions, second protrusions, a conductive unit, and an encapsulation material. The device includes a substrate, an active layer, first electrodes, second electrodes and a third electrode. The first electrodes have different potentials than the second electrodes. The first electrodes and the second electrodes are arranged so that they alternate with each other. The first protrusions are disposed on each of the first electrodes. The second protrusions are disposed on each of the second electrodes. The first protrusions and the second protrusions are connected to the leadframe. The first side of the conductive unit is connected to the substrate of the device. The conductive unit is connected to the leadframe. The encapsulation material covers the device and the leadframe. The second side of the conductive unit is exposed from the encapsulation material.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Package structures |
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