CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

A chip packaging method includes: providing plural chip units; providing a base material, and placing the chip units on the base material; providing an adhesive layer to adhere a metal foil to the chip unit, wherein the metal foil is a part of the base material or additional to the base material; an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YEN, HAO-LIN, HUANG, HENGI, HU, YONG-ZHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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