Semiconductor structure and method for semiconductor processing

The present disclosure provides methods for forming conductive features in a dielectric layer without using adhesion layers or barrier layers and devices formed thereby. In some embodiments, a structure comprising a dielectric layer over a substrate, and a conductive feature disposed through the die...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG, TING-KUI, LIU, SU-HAO, CHEN, KUO-JU, CHANG, TANG-KUEI, CHEN, KEI-WEI, WANG, YING-LANG, CHEN, LIANG-YIN, CHANG, HUING, LEE, CHIA-HSUAN, WU, LIIEH, WEI, KUO-HSIU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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