TWI744265B

To provide a composition for semiconductor cleaning capable of suppressing damage given to metal wiring or the like of an object to be polished and effectively removing contamination from the surface of the object to be polished, and also to provide a cleaning method using the same. Disclosed is a c...

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Bibliographische Detailangaben
Hauptverfasser:	HAYAMA, TAKAHIRO, KAMEI, YASUTAKA, KAMO, SATOSHI, SHINODA, TOMOTAKA, NISHIGUCHI, NAOKI
Format:	Patent
Sprache:	chi
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	To provide a composition for semiconductor cleaning capable of suppressing damage given to metal wiring or the like of an object to be polished and effectively removing contamination from the surface of the object to be polished, and also to provide a cleaning method using the same. Disclosed is a composition for semiconductor cleaning, which contains potassium and sodium. When the content of potassium is M(ppm), and the content of sodium is M(ppm), M/M=5103 to 1105 is satisfied.