TWI742579B

A heat exchange system is arranged between a chiller device and a temperature control member, and is provided with: supply line for supplying a refrigerant from the chiller device to the temperature control member; a return line for returning the refrigerant from the temperature control member to th...

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Hauptverfasser:	NITTA, SHINICHI, MINATANI, TAKAHIRO, ITO, AKIHIRO
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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creator	NITTA, SHINICHI MINATANI, TAKAHIRO ITO, AKIHIRO
description	A heat exchange system is arranged between a chiller device and a temperature control member, and is provided with: supply line for supplying a refrigerant from the chiller device to the temperature control member; a return line for returning the refrigerant from the temperature control member to the chiller device; a bypass line for bypassing the supply line and the return line; a latent heat storage member arranged closer to the chiller device relative to a first connection point connecting the return line and the bypass line; and a flow distribution unit that is arranged at a second connection point connecting the outgoing line and the bypass line, and that is for adjusting a ratio for distributing refrigerant to the temperature control member and the bypass line.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI742579BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI742579BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI742579BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfc0NzEyNbd04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADkEblw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI742579B</title><source>esp@cenet</source><creator>NITTA, SHINICHI ; MINATANI, TAKAHIRO ; ITO, AKIHIRO</creator><creatorcontrib>NITTA, SHINICHI ; MINATANI, TAKAHIRO ; ITO, AKIHIRO</creatorcontrib><description>A heat exchange system is arranged between a chiller device and a temperature control member, and is provided with: supply line for supplying a refrigerant from the chiller device to the temperature control member; a return line for returning the refrigerant from the temperature control member to the chiller device; a bypass line for bypassing the supply line and the return line; a latent heat storage member arranged closer to the chiller device relative to a first connection point connecting the return line and the bypass line; and a flow distribution unit that is arranged at a second connection point connecting the outgoing line and the bypass line, and that is for adjusting a ratio for distributing refrigerant to the temperature control member and the bypass line.</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211011&DB=EPODOC&CC=TW&NR=I742579B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211011&DB=EPODOC&CC=TW&NR=I742579B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NITTA, SHINICHI</creatorcontrib><creatorcontrib>MINATANI, TAKAHIRO</creatorcontrib><creatorcontrib>ITO, AKIHIRO</creatorcontrib><title>TWI742579B</title><description>A heat exchange system is arranged between a chiller device and a temperature control member, and is provided with: supply line for supplying a refrigerant from the chiller device to the temperature control member; a return line for returning the refrigerant from the temperature control member to the chiller device; a bypass line for bypassing the supply line and the return line; a latent heat storage member arranged closer to the chiller device relative to a first connection point connecting the return line and the bypass line; and a flow distribution unit that is arranged at a second connection point connecting the outgoing line and the bypass line, and that is for adjusting a ratio for distributing refrigerant to the temperature control member and the bypass line.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0NzEyNbd04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADkEblw</recordid><startdate>20211011</startdate><enddate>20211011</enddate><creator>NITTA, SHINICHI</creator><creator>MINATANI, TAKAHIRO</creator><creator>ITO, AKIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20211011</creationdate><title>TWI742579B</title><author>NITTA, SHINICHI ; MINATANI, TAKAHIRO ; ITO, AKIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI742579BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>NITTA, SHINICHI</creatorcontrib><creatorcontrib>MINATANI, TAKAHIRO</creatorcontrib><creatorcontrib>ITO, AKIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NITTA, SHINICHI</au><au>MINATANI, TAKAHIRO</au><au>ITO, AKIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI742579B</title><date>2021-10-11</date><risdate>2021</risdate><abstract>A heat exchange system is arranged between a chiller device and a temperature control member, and is provided with: supply line for supplying a refrigerant from the chiller device to the temperature control member; a return line for returning the refrigerant from the temperature control member to the chiller device; a bypass line for bypassing the supply line and the return line; a latent heat storage member arranged closer to the chiller device relative to a first connection point connecting the return line and the bypass line; and a flow distribution unit that is arranged at a second connection point connecting the outgoing line and the bypass line, and that is for adjusting a ratio for distributing refrigerant to the temperature control member and the bypass line.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
title	TWI742579B
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T21%3A04%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NITTA,%20SHINICHI&rft.date=2021-10-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI742579BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true