TWI742452B
An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electro...
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| creator | WATANABE, MAKI ABE, SHINTARO SUGISAWA, TAKEKI AKINIWA, TAKASHI OMORI, TOSHINORI KONDO, TAKESHI OSANAI, YASUAKI GOTO, KAZUYA |
| description | An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the |
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TESTING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211011&DB=EPODOC&CC=TW&NR=I742452B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211011&DB=EPODOC&CC=TW&NR=I742452B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATANABE, MAKI</creatorcontrib><creatorcontrib>ABE, SHINTARO</creatorcontrib><creatorcontrib>SUGISAWA, TAKEKI</creatorcontrib><creatorcontrib>AKINIWA, TAKASHI</creatorcontrib><creatorcontrib>OMORI, TOSHINORI</creatorcontrib><creatorcontrib>KONDO, TAKESHI</creatorcontrib><creatorcontrib>OSANAI, YASUAKI</creatorcontrib><creatorcontrib>GOTO, KAZUYA</creatorcontrib><title>TWI742452B</title><description>An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0NzEyMTVy4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACRcbeQ</recordid><startdate>20211011</startdate><enddate>20211011</enddate><creator>WATANABE, MAKI</creator><creator>ABE, SHINTARO</creator><creator>SUGISAWA, TAKEKI</creator><creator>AKINIWA, TAKASHI</creator><creator>OMORI, TOSHINORI</creator><creator>KONDO, TAKESHI</creator><creator>OSANAI, YASUAKI</creator><creator>GOTO, KAZUYA</creator><scope>EVB</scope></search><sort><creationdate>20211011</creationdate><title>TWI742452B</title><author>WATANABE, MAKI ; 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | TWI742452B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T04%3A01%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WATANABE,%20MAKI&rft.date=2021-10-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI742452BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |