TWI739882B

An object of the present invention is to divide a wafer into chips while suppressing the occurrence of missing corners and unnecessary cracks. The invention relates to a wafer processing method, and more particularly to a wafer processing method having a surface where a device is respectively formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MANTOKU, KIMITAKE, AGARI, MASAMITSU
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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