TWI734841B
The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member an...
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| creator | TANAKA, MASARU TAKETATSU, JUN MORIJIRI, TOMOKI KUME, MASAHIDE |
| description | The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member and which electrically connects the first circuit electrode and the second circuit electrode to each other, wherein the linear thermal expansion amount L(t) of the circuit connection member at temperature (t) satisfies the condition dL(t)/dt |
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a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member and which electrically connects the first circuit electrode and the second circuit electrode to each other, wherein the linear thermal expansion amount L(t) of the circuit connection member at temperature (t) satisfies the condition dL(t)/dt<0 at least at a point within t = 30°C to 12°C.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0NzaxMDF04mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACrsbgg</recordid><startdate>20210801</startdate><enddate>20210801</enddate><creator>TANAKA, MASARU</creator><creator>TAKETATSU, JUN</creator><creator>MORIJIRI, TOMOKI</creator><creator>KUME, MASAHIDE</creator><scope>EVB</scope></search><sort><creationdate>20210801</creationdate><title>TWI734841B</title><author>TANAKA, MASARU ; TAKETATSU, JUN ; MORIJIRI, TOMOKI ; KUME, MASAHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI734841BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA, MASARU</creatorcontrib><creatorcontrib>TAKETATSU, JUN</creatorcontrib><creatorcontrib>MORIJIRI, TOMOKI</creatorcontrib><creatorcontrib>KUME, MASAHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA, MASARU</au><au>TAKETATSU, JUN</au><au>MORIJIRI, TOMOKI</au><au>KUME, MASAHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI734841B</title><date>2021-08-01</date><risdate>2021</risdate><abstract>The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member and which electrically connects the first circuit electrode and the second circuit electrode to each other, wherein the linear thermal expansion amount L(t) of the circuit connection member at temperature (t) satisfies the condition dL(t)/dt<0 at least at a point within t = 30°C to 12°C.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | TWI734841B |
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