Micromechanical spring for a sensor element

A micromechanical spring for a sensor element, including at least two spring sections formed along a sensing axis, the at least two spring sections each having a defined length, and the at least two spring sections having different defined widths.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: EID, RUDY, KOSTER, MONIKA
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator EID, RUDY
KOSTER, MONIKA
description A micromechanical spring for a sensor element, including at least two spring sections formed along a sensing axis, the at least two spring sections each having a defined length, and the at least two spring sections having different defined widths.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI732056BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI732056BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI732056BB3</originalsourceid><addsrcrecordid>eNrjZND2zUwuys9NTc5IzMtMTsxRKC4oysxLV0jLL1JIVChOzSsGMlJzUnNT80p4GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8SLinubGRgamZk5MxEUoAJh8piA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Micromechanical spring for a sensor element</title><source>esp@cenet</source><creator>EID, RUDY ; KOSTER, MONIKA</creator><creatorcontrib>EID, RUDY ; KOSTER, MONIKA</creatorcontrib><description>A micromechanical spring for a sensor element, including at least two spring sections formed along a sensing axis, the at least two spring sections each having a defined length, and the at least two spring sections having different defined widths.</description><language>chi ; eng</language><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210701&amp;DB=EPODOC&amp;CC=TW&amp;NR=I732056B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210701&amp;DB=EPODOC&amp;CC=TW&amp;NR=I732056B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EID, RUDY</creatorcontrib><creatorcontrib>KOSTER, MONIKA</creatorcontrib><title>Micromechanical spring for a sensor element</title><description>A micromechanical spring for a sensor element, including at least two spring sections formed along a sensing axis, the at least two spring sections each having a defined length, and the at least two spring sections having different defined widths.</description><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND2zUwuys9NTc5IzMtMTsxRKC4oysxLV0jLL1JIVChOzSsGMlJzUnNT80p4GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8SLinubGRgamZk5MxEUoAJh8piA</recordid><startdate>20210701</startdate><enddate>20210701</enddate><creator>EID, RUDY</creator><creator>KOSTER, MONIKA</creator><scope>EVB</scope></search><sort><creationdate>20210701</creationdate><title>Micromechanical spring for a sensor element</title><author>EID, RUDY ; KOSTER, MONIKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI732056BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>EID, RUDY</creatorcontrib><creatorcontrib>KOSTER, MONIKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>EID, RUDY</au><au>KOSTER, MONIKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Micromechanical spring for a sensor element</title><date>2021-07-01</date><risdate>2021</risdate><abstract>A micromechanical spring for a sensor element, including at least two spring sections formed along a sensing axis, the at least two spring sections each having a defined length, and the at least two spring sections having different defined widths.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TWI732056BB
source esp@cenet
subjects MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
title Micromechanical spring for a sensor element
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T23%3A08%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=EID,%20RUDY&rft.date=2021-07-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI732056BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true