Structure and method of fabricating three-dimensional (3d) metal-insulator-metal (mim) capacitor and resistor in semi-additive plating metal wiring

Structure and method of fabricating three-dimensional (3d) metal-insulator-metal (mim) capacitor and resistor in semi-additive plating metal wiring

Methods of processing a substrate include: providing a substrate having a polymer dielectric layer, a metal pad formed within the polymer dielectric layer and a first metal layer formed atop the polymer dielectric layer; depositing a polymer layer atop the substrate; patterning the polymer layer to...

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Hauptverfasser: SEE, GUAN HUEI, TOH, CHIN HOCK, MORI, GLEN T, SUNDARRAJAN, ARVID
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SEE, GUAN HUEI
TOH, CHIN HOCK
MORI, GLEN T
SUNDARRAJAN, ARVID
description Methods of processing a substrate include: providing a substrate having a polymer dielectric layer, a metal pad formed within the polymer dielectric layer and a first metal layer formed atop the polymer dielectric layer; depositing a polymer layer atop the substrate; patterning the polymer layer to form a plurality of openings, wherein the plurality of openings comprises a first opening formed proximate the metal pad; depositing a first barrier layer atop the polymer layer; depositing a dielectric layer atop the first barrier layer; etching the dielectric layer and the first barrier layer from within the first opening and a field region of the polymer layer; depositing a second barrier layer atop the substrate; depositing a second metal layer atop the substrate wherein the second metal layer fills the plurality of openings; and etching the second metal layer from a portion of the field region of the polymer layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Structure and method of fabricating three-dimensional (3d) metal-insulator-metal (mim) capacitor and resistor in semi-additive plating metal wiring
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