TWI724695B

The present invention provides a resin molding device capable of precisely controlling the ejection amount of a liquid resin. The resin molding device includes a resin ejection unit (19), a flow sensor (100), a resin molding unit and a controlling section (22), wherein the resin ejection unit (19) i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HANASAKI, MASANORI, GOTO, TOMOYUKI, HANASAKA, SHUHO
Format:	Patent
Sprache:	chi
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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