TWI724695B
The present invention provides a resin molding device capable of precisely controlling the ejection amount of a liquid resin. The resin molding device includes a resin ejection unit (19), a flow sensor (100), a resin molding unit and a controlling section (22), wherein the resin ejection unit (19) i...
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| creator | HANASAKI, MASANORI GOTO, TOMOYUKI HANASAKA, SHUHO |
| description | The present invention provides a resin molding device capable of precisely controlling the ejection amount of a liquid resin. The resin molding device includes a resin ejection unit (19), a flow sensor (100), a resin molding unit and a controlling section (22), wherein the resin ejection unit (19) includes a plunger (35) and a resin receiving portion (28) capable of receiving a liquid resin (30), has an ejection port (41) through which the liquid resin (30) is ejected, and ejects the liquid resin (30) received in the resin receiving portion (28) from the ejection port (41) through the movement of the plunger (35); the flow sensor (100) is mounted to the resin ejection unit (19) and measures the flow of the liquid resin (30); the resin molding unit carries out resin molding using the liquid resin (30) ejected from the resin ejection unit (19); and the controlling section (22) controls the orientation of the plunger (35) and controls the suck back of the plunger (35) based on the flow of the liquid resin (30) m |
| format | Patent |
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The resin molding device includes a resin ejection unit (19), a flow sensor (100), a resin molding unit and a controlling section (22), wherein the resin ejection unit (19) includes a plunger (35) and a resin receiving portion (28) capable of receiving a liquid resin (30), has an ejection port (41) through which the liquid resin (30) is ejected, and ejects the liquid resin (30) received in the resin receiving portion (28) from the ejection port (41) through the movement of the plunger (35); the flow sensor (100) is mounted to the resin ejection unit (19) and measures the flow of the liquid resin (30); the resin molding unit carries out resin molding using the liquid resin (30) ejected from the resin ejection unit (19); and the controlling section (22) controls the orientation of the plunger (35) and controls the suck back of the plunger (35) based on the flow of the liquid resin (30) m</description><language>chi</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210411&DB=EPODOC&CC=TW&NR=I724695B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210411&DB=EPODOC&CC=TW&NR=I724695B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANASAKI, MASANORI</creatorcontrib><creatorcontrib>GOTO, TOMOYUKI</creatorcontrib><creatorcontrib>HANASAKA, SHUHO</creatorcontrib><title>TWI724695B</title><description>The present invention provides a resin molding device capable of precisely controlling the ejection amount of a liquid resin. The resin molding device includes a resin ejection unit (19), a flow sensor (100), a resin molding unit and a controlling section (22), wherein the resin ejection unit (19) includes a plunger (35) and a resin receiving portion (28) capable of receiving a liquid resin (30), has an ejection port (41) through which the liquid resin (30) is ejected, and ejects the liquid resin (30) received in the resin receiving portion (28) from the ejection port (41) through the movement of the plunger (35); the flow sensor (100) is mounted to the resin ejection unit (19) and measures the flow of the liquid resin (30); the resin molding unit carries out resin molding using the liquid resin (30) ejected from the resin ejection unit (19); and the controlling section (22) controls the orientation of the plunger (35) and controls the suck back of the plunger (35) based on the flow of the liquid resin (30) m</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0NzIxszR14mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADcQblA</recordid><startdate>20210411</startdate><enddate>20210411</enddate><creator>HANASAKI, MASANORI</creator><creator>GOTO, TOMOYUKI</creator><creator>HANASAKA, SHUHO</creator><scope>EVB</scope></search><sort><creationdate>20210411</creationdate><title>TWI724695B</title><author>HANASAKI, MASANORI ; GOTO, TOMOYUKI ; HANASAKA, SHUHO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI724695BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>HANASAKI, MASANORI</creatorcontrib><creatorcontrib>GOTO, TOMOYUKI</creatorcontrib><creatorcontrib>HANASAKA, SHUHO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANASAKI, MASANORI</au><au>GOTO, TOMOYUKI</au><au>HANASAKA, SHUHO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI724695B</title><date>2021-04-11</date><risdate>2021</risdate><abstract>The present invention provides a resin molding device capable of precisely controlling the ejection amount of a liquid resin. The resin molding device includes a resin ejection unit (19), a flow sensor (100), a resin molding unit and a controlling section (22), wherein the resin ejection unit (19) includes a plunger (35) and a resin receiving portion (28) capable of receiving a liquid resin (30), has an ejection port (41) through which the liquid resin (30) is ejected, and ejects the liquid resin (30) received in the resin receiving portion (28) from the ejection port (41) through the movement of the plunger (35); the flow sensor (100) is mounted to the resin ejection unit (19) and measures the flow of the liquid resin (30); the resin molding unit carries out resin molding using the liquid resin (30) ejected from the resin ejection unit (19); and the controlling section (22) controls the orientation of the plunger (35) and controls the suck back of the plunger (35) based on the flow of the liquid resin (30) m</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | TWI724695B |
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