Electrodepositing solution and electrodeposition coated body
Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100°C and D (S-P) represented by a formula (1) satisfying a relationship of D (S-P...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | HIRANO, KOJI HIRATA, JYUNKO SAKURAI, HIDEAKI IIDA, SHINTARO |
description | Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100°C and D (S-P) represented by a formula (1) satisfying a relationship of D (S-P) |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI715724BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI715724BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI715724BB3</originalsourceid><addsrcrecordid>eNrjZLBxzUlNLinKT0ktyC_OLMnMS1cozs8pLcnMz1NIzEtRSEWVBoom5yeWpKYoJOWnVPIwsKYl5hSn8kJpbgYFN9cQZw9doOr41OKCxOTUvNSS-JBwT3NDU3MjEycnYyKUAAAQvDDf</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electrodepositing solution and electrodeposition coated body</title><source>esp@cenet</source><creator>HIRANO, KOJI ; HIRATA, JYUNKO ; SAKURAI, HIDEAKI ; IIDA, SHINTARO</creator><creatorcontrib>HIRANO, KOJI ; HIRATA, JYUNKO ; SAKURAI, HIDEAKI ; IIDA, SHINTARO</creatorcontrib><description>Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100°C and D (S-P) represented by a formula (1) satisfying a relationship of D (S-P) <6, and a weight-average molecular weight of the polyamide-imide is 10×10 4 to 30×10 4 or a number-average molecular weight of the polyamide-imide is 2×10 4 to 5×10 4 . D S P = dD S dD P 2 + dP S dP P 2 + dH S dH P 2 1 / 2</description><language>chi ; eng</language><subject>ADHESIVES ; APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; FILLING PASTES ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210111&DB=EPODOC&CC=TW&NR=I715724B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210111&DB=EPODOC&CC=TW&NR=I715724B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRANO, KOJI</creatorcontrib><creatorcontrib>HIRATA, JYUNKO</creatorcontrib><creatorcontrib>SAKURAI, HIDEAKI</creatorcontrib><creatorcontrib>IIDA, SHINTARO</creatorcontrib><title>Electrodepositing solution and electrodeposition coated body</title><description>Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100°C and D (S-P) represented by a formula (1) satisfying a relationship of D (S-P) <6, and a weight-average molecular weight of the polyamide-imide is 10×10 4 to 30×10 4 or a number-average molecular weight of the polyamide-imide is 2×10 4 to 5×10 4 . D S P = dD S dD P 2 + dP S dP P 2 + dH S dH P 2 1 / 2</description><subject>ADHESIVES</subject><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxzUlNLinKT0ktyC_OLMnMS1cozs8pLcnMz1NIzEtRSEWVBoom5yeWpKYoJOWnVPIwsKYl5hSn8kJpbgYFN9cQZw9doOr41OKCxOTUvNSS-JBwT3NDU3MjEycnYyKUAAAQvDDf</recordid><startdate>20210111</startdate><enddate>20210111</enddate><creator>HIRANO, KOJI</creator><creator>HIRATA, JYUNKO</creator><creator>SAKURAI, HIDEAKI</creator><creator>IIDA, SHINTARO</creator><scope>EVB</scope></search><sort><creationdate>20210111</creationdate><title>Electrodepositing solution and electrodeposition coated body</title><author>HIRANO, KOJI ; HIRATA, JYUNKO ; SAKURAI, HIDEAKI ; IIDA, SHINTARO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI715724BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>ADHESIVES</topic><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRANO, KOJI</creatorcontrib><creatorcontrib>HIRATA, JYUNKO</creatorcontrib><creatorcontrib>SAKURAI, HIDEAKI</creatorcontrib><creatorcontrib>IIDA, SHINTARO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRANO, KOJI</au><au>HIRATA, JYUNKO</au><au>SAKURAI, HIDEAKI</au><au>IIDA, SHINTARO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrodepositing solution and electrodeposition coated body</title><date>2021-01-11</date><risdate>2021</risdate><abstract>Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100°C and D (S-P) represented by a formula (1) satisfying a relationship of D (S-P) <6, and a weight-average molecular weight of the polyamide-imide is 10×10 4 to 30×10 4 or a number-average molecular weight of the polyamide-imide is 2×10 4 to 5×10 4 . D S P = dD S dD P 2 + dP S dP P 2 + dH S dH P 2 1 / 2</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_TWI715724BB |
source | esp@cenet |
subjects | ADHESIVES APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FILLING PASTES INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS |
title | Electrodepositing solution and electrodeposition coated body |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T03%3A43%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIRANO,%20KOJI&rft.date=2021-01-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI715724BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |