ANTENNA MODULE
An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package...
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| creator | JUNG, GUK HEE JUNG, KYOUNG OK JUNG, HYUNG MI |
| description | An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other. |
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eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201121&DB=EPODOC&CC=TW&NR=I711217B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201121&DB=EPODOC&CC=TW&NR=I711217B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG, GUK HEE</creatorcontrib><creatorcontrib>JUNG, KYOUNG OK</creatorcontrib><creatorcontrib>JUNG, HYUNG MI</creatorcontrib><title>ANTENNA MODULE</title><description>An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBz9Atx9fNzVPD1dwn1ceVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfEh4Z7mhoZGhuZOTsZEKAEAmO8c8A</recordid><startdate>20201121</startdate><enddate>20201121</enddate><creator>JUNG, GUK HEE</creator><creator>JUNG, KYOUNG OK</creator><creator>JUNG, HYUNG MI</creator><scope>EVB</scope></search><sort><creationdate>20201121</creationdate><title>ANTENNA MODULE</title><author>JUNG, GUK HEE ; JUNG, KYOUNG OK ; JUNG, HYUNG MI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI711217BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JUNG, GUK HEE</creatorcontrib><creatorcontrib>JUNG, KYOUNG OK</creatorcontrib><creatorcontrib>JUNG, HYUNG MI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JUNG, GUK HEE</au><au>JUNG, KYOUNG OK</au><au>JUNG, HYUNG MI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ANTENNA MODULE</title><date>2020-11-21</date><risdate>2020</risdate><abstract>An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | ANTENNA MODULE |
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