Surface polishing apparatus
The present invention provides a plane grinding device, and aims to prevent the damage to a cable at a static part side or a rotation part side by preventing the contact of the cable at the static part side and the rotation part or the contact of the cable at the rotation part side and the static pa...
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| creator | ODAGIRI, SHIGERU INOUE, YUSUKE YOSHIHARA, HIDEAKI KOIKE, YOSHIO |
| description | The present invention provides a plane grinding device, and aims to prevent the damage to a cable at a static part side or a rotation part side by preventing the contact of the cable at the static part side and the rotation part or the contact of the cable at the rotation part side and the static part, thereby realizing the stable grinding processing. A first cable cover 73 and a second cable cover 74 between which a space part 75 is maintained are arranged at the positions of covering the cable 53 connected with a rotation side joint part 36 of a rotating joint 60, and the cable 53 connected with the rotation side joint part 63 is accommodated in the space part 75 between the two cable covers (73, 74). |
| format | Patent |
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A first cable cover 73 and a second cable cover 74 between which a space part 75 is maintained are arranged at the positions of covering the cable 53 connected with a rotation side joint part 36 of a rotating joint 60, and the cable 53 connected with the rotation side joint part 63 is accommodated in the space part 75 between the two cable covers (73, 74).</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201111&DB=EPODOC&CC=TW&NR=I709458B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201111&DB=EPODOC&CC=TW&NR=I709458B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ODAGIRI, SHIGERU</creatorcontrib><creatorcontrib>INOUE, YUSUKE</creatorcontrib><creatorcontrib>YOSHIHARA, HIDEAKI</creatorcontrib><creatorcontrib>KOIKE, YOSHIO</creatorcontrib><title>Surface polishing apparatus</title><description>The present invention provides a plane grinding device, and aims to prevent the damage to a cable at a static part side or a rotation part side by preventing the contact of the cable at the static part side and the rotation part or the contact of the cable at the rotation part side and the static part, thereby realizing the stable grinding processing. A first cable cover 73 and a second cable cover 74 between which a space part 75 is maintained are arranged at the positions of covering the cable 53 connected with a rotation side joint part 36 of a rotating joint 60, and the cable 53 connected with the rotation side joint part 63 is accommodated in the space part 75 between the two cable covers (73, 74).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAOLi1KS0xOVSjIz8kszsjMS1dILChILEosKS3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQVAbXmpJfEh4Z7mBpYmphZOTsZEKAEAWvQj1Q</recordid><startdate>20201111</startdate><enddate>20201111</enddate><creator>ODAGIRI, SHIGERU</creator><creator>INOUE, YUSUKE</creator><creator>YOSHIHARA, HIDEAKI</creator><creator>KOIKE, YOSHIO</creator><scope>EVB</scope></search><sort><creationdate>20201111</creationdate><title>Surface polishing apparatus</title><author>ODAGIRI, SHIGERU ; INOUE, YUSUKE ; YOSHIHARA, HIDEAKI ; KOIKE, YOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI709458BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ODAGIRI, SHIGERU</creatorcontrib><creatorcontrib>INOUE, YUSUKE</creatorcontrib><creatorcontrib>YOSHIHARA, HIDEAKI</creatorcontrib><creatorcontrib>KOIKE, YOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ODAGIRI, SHIGERU</au><au>INOUE, YUSUKE</au><au>YOSHIHARA, HIDEAKI</au><au>KOIKE, YOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Surface polishing apparatus</title><date>2020-11-11</date><risdate>2020</risdate><abstract>The present invention provides a plane grinding device, and aims to prevent the damage to a cable at a static part side or a rotation part side by preventing the contact of the cable at the static part side and the rotation part or the contact of the cable at the rotation part side and the static part, thereby realizing the stable grinding processing. A first cable cover 73 and a second cable cover 74 between which a space part 75 is maintained are arranged at the positions of covering the cable 53 connected with a rotation side joint part 36 of a rotating joint 60, and the cable 53 connected with the rotation side joint part 63 is accommodated in the space part 75 between the two cable covers (73, 74).</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Surface polishing apparatus |
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