Extreme uniformity heated substrate support assembly

Extreme uniformity heated substrate support assembly

Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mount...

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Hauptverfasser: LUBOMIRSKY, DMITRY, BENJAMINSON, DAVID, SAMIR, MEHMET TUGRUL, PARKHE, VIJAY D, FLOYD, KIRBY H, WANG, JUSTIN, KORA SIDDARAMAIAH, ONKARA SWAMY
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Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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creator LUBOMIRSKY, DMITRY
BENJAMINSON, DAVID
SAMIR, MEHMET TUGRUL
PARKHE, VIJAY D
FLOYD, KIRBY H
WANG, JUSTIN
KORA SIDDARAMAIAH, ONKARA SWAMY
description Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 microns flat.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI702685BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI702685BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI702685BB3</originalsourceid><addsrcrecordid>eNrjZDBxrSgpSs1NVSjNy0zLL8rNLKlUyEhNLElNUSguTSouKQIygayCgvyiEoXE4uLU3KScSh4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEh8S7mluYGRmYerkZEyEEgBMfy3S</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Extreme uniformity heated substrate support assembly</title><source>esp@cenet</source><creator>LUBOMIRSKY, DMITRY ; BENJAMINSON, DAVID ; SAMIR, MEHMET TUGRUL ; PARKHE, VIJAY D ; FLOYD, KIRBY H ; WANG, JUSTIN ; KORA SIDDARAMAIAH, ONKARA SWAMY</creator><creatorcontrib>LUBOMIRSKY, DMITRY ; BENJAMINSON, DAVID ; SAMIR, MEHMET TUGRUL ; PARKHE, VIJAY D ; FLOYD, KIRBY H ; WANG, JUSTIN ; KORA SIDDARAMAIAH, ONKARA SWAMY</creatorcontrib><description>Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 microns flat.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200821&amp;DB=EPODOC&amp;CC=TW&amp;NR=I702685B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200821&amp;DB=EPODOC&amp;CC=TW&amp;NR=I702685B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LUBOMIRSKY, DMITRY</creatorcontrib><creatorcontrib>BENJAMINSON, DAVID</creatorcontrib><creatorcontrib>SAMIR, MEHMET TUGRUL</creatorcontrib><creatorcontrib>PARKHE, VIJAY D</creatorcontrib><creatorcontrib>FLOYD, KIRBY H</creatorcontrib><creatorcontrib>WANG, JUSTIN</creatorcontrib><creatorcontrib>KORA SIDDARAMAIAH, ONKARA SWAMY</creatorcontrib><title>Extreme uniformity heated substrate support assembly</title><description>Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 microns flat.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBxrSgpSs1NVSjNy0zLL8rNLKlUyEhNLElNUSguTSouKQIygayCgvyiEoXE4uLU3KScSh4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEh8S7mluYGRmYerkZEyEEgBMfy3S</recordid><startdate>20200821</startdate><enddate>20200821</enddate><creator>LUBOMIRSKY, DMITRY</creator><creator>BENJAMINSON, DAVID</creator><creator>SAMIR, MEHMET TUGRUL</creator><creator>PARKHE, VIJAY D</creator><creator>FLOYD, KIRBY H</creator><creator>WANG, JUSTIN</creator><creator>KORA SIDDARAMAIAH, ONKARA SWAMY</creator><scope>EVB</scope></search><sort><creationdate>20200821</creationdate><title>Extreme uniformity heated substrate support assembly</title><author>LUBOMIRSKY, DMITRY ; BENJAMINSON, DAVID ; SAMIR, MEHMET TUGRUL ; PARKHE, VIJAY D ; FLOYD, KIRBY H ; WANG, JUSTIN ; KORA SIDDARAMAIAH, ONKARA SWAMY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI702685BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LUBOMIRSKY, DMITRY</creatorcontrib><creatorcontrib>BENJAMINSON, DAVID</creatorcontrib><creatorcontrib>SAMIR, MEHMET TUGRUL</creatorcontrib><creatorcontrib>PARKHE, VIJAY D</creatorcontrib><creatorcontrib>FLOYD, KIRBY H</creatorcontrib><creatorcontrib>WANG, JUSTIN</creatorcontrib><creatorcontrib>KORA SIDDARAMAIAH, ONKARA SWAMY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LUBOMIRSKY, DMITRY</au><au>BENJAMINSON, DAVID</au><au>SAMIR, MEHMET TUGRUL</au><au>PARKHE, VIJAY D</au><au>FLOYD, KIRBY H</au><au>WANG, JUSTIN</au><au>KORA SIDDARAMAIAH, ONKARA SWAMY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Extreme uniformity heated substrate support assembly</title><date>2020-08-21</date><risdate>2020</risdate><abstract>Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 microns flat.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
title Extreme uniformity heated substrate support assembly
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T23%3A49%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LUBOMIRSKY,%20DMITRY&rft.date=2020-08-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI702685BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true