Substrate processing method and substrate processing apparatus

A substrate treatment method, whereby it becomes possible to supply a silicon-containing aqueous phosphate solution to a substrate having both of a silicon oxide film and a silicon nitride film exposed on the surface thereof so as to selectively etch the silicon nitride film. The method includes: a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HORIGUCHI, OSAMU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!