TWI698413B
Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present inventio...
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creator | TAKEDA, TAKUMA SATO, SHOHEI |
description | Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t |
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The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t</description><language>chi</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC CHEMISTRY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200711&DB=EPODOC&CC=TW&NR=I698413B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200711&DB=EPODOC&CC=TW&NR=I698413B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEDA, TAKUMA</creatorcontrib><creatorcontrib>SATO, SHOHEI</creatorcontrib><title>TWI698413B</title><description>Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t</description><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0s7QwMTR24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADQMbjg</recordid><startdate>20200711</startdate><enddate>20200711</enddate><creator>TAKEDA, TAKUMA</creator><creator>SATO, SHOHEI</creator><scope>EVB</scope></search><sort><creationdate>20200711</creationdate><title>TWI698413B</title><author>TAKEDA, TAKUMA ; SATO, SHOHEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI698413BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2020</creationdate><topic>ACYCLIC OR CARBOCYCLIC COMPOUNDS</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEDA, TAKUMA</creatorcontrib><creatorcontrib>SATO, SHOHEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEDA, TAKUMA</au><au>SATO, SHOHEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI698413B</title><date>2020-07-11</date><risdate>2020</risdate><abstract>Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ACYCLIC OR CARBOCYCLIC COMPOUNDS APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC CHEMISTRY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | TWI698413B |
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