TWI698413B

Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present inventio...

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Hauptverfasser: TAKEDA, TAKUMA, SATO, SHOHEI
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creator TAKEDA, TAKUMA
SATO, SHOHEI
description Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t
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The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t</description><language>chi</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC CHEMISTRY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200711&amp;DB=EPODOC&amp;CC=TW&amp;NR=I698413B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200711&amp;DB=EPODOC&amp;CC=TW&amp;NR=I698413B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEDA, TAKUMA</creatorcontrib><creatorcontrib>SATO, SHOHEI</creatorcontrib><title>TWI698413B</title><description>Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. The resist substrate preprocessing composition of the present invention is a resist substrate preprocessing composition which contains an ampholytic surface-active agent (A1), an anionic surface-active agent (A2), and water, characterized in that: a numerical value obtained by subtracting, from a numerical value of an isoelectric point of the ampholytic surface-active agent (A1), a numerical value of the pH of the resist substrate preprocessing composition ([numerical value of isoelectric point of ampholytic surface-active agent (A1)] - [numerical value of pH of resist substrate preprocessing composition]) is -3 to 4; and the ratio of the mole number of the ampholytic surface-active agent (A1) to a total mole number of the mole number of the ampholytic surface-active agent (A1) and t</description><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0s7QwMTR24mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEADQMbjg</recordid><startdate>20200711</startdate><enddate>20200711</enddate><creator>TAKEDA, TAKUMA</creator><creator>SATO, SHOHEI</creator><scope>EVB</scope></search><sort><creationdate>20200711</creationdate><title>TWI698413B</title><author>TAKEDA, TAKUMA ; SATO, SHOHEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI698413BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2020</creationdate><topic>ACYCLIC OR CARBOCYCLIC COMPOUNDS</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEDA, TAKUMA</creatorcontrib><creatorcontrib>SATO, SHOHEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEDA, TAKUMA</au><au>SATO, SHOHEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI698413B</title><date>2020-07-11</date><risdate>2020</risdate><abstract>Provided is a resist substrate preprocessing composition with which wetting and spreading of resist ink after application by an inkjet method can be suppressed, making it possible to form a fine resist pattern with high accuracy. 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subjects ACYCLIC OR CARBOCYCLIC COMPOUNDS
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC CHEMISTRY
PERFORMING OPERATIONS
PRINTED CIRCUITS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title TWI698413B
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