Electronic device package structure

An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG, JING-YAO, HAN, WEI-KUO, CHANG, TAOIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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