Liquid epoxy resin composition for encapsulation and electronic component device

A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the conten...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUNIMI, MAKOTO, NOJIRI, NAOYUKI, HORI, KOHJI, TAKAHASHI, HISATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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