TWI685046B

The present invention comprises: a stage (20) that includes a suction surface (22) that suctions a sheet (12); a push-up member (30) that pushes up the sheet (12); and a three-way valve (67) that switches the opening pressure of an opening (23) between a first pressure that is near a vacuum and a second pressure that is near atmospheric pressure. When a semiconductor die (15) is picked up together with a viscoelastic film (11), the opening pressure is caused to vibrate at a prescribed frequency that corresponds to the viscoelastic characteristics of the viscoelastic film (11) when the suction pressure of the suction surface (22) is set at a third pressure that is near a vacuum, and the sheet (12) is pushed up by the push-up member (30). A thin semiconductor die affixed to the surface of the sheet by the viscoelastic film is thereby picked up from the surface of the sheet together with the viscoelastic film.