Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits

A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a hi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PRUITT, DAVID A, BEVILLE, FREDERICK E, BRAZZLE, JOHN DAVID
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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