TWI676222B
An evacuation method used for a vacuum processing apparatus including a vacuum processing chamber is provided. The vacuum processing chamber is evacuated by an exhaust device for a first predetermined period of time by opening a valve connecting the exhaust device with the vacuum processing chamber....
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creator | YAKUSHIJI, HIDEAKI HAGA, HIROFUMI NAKAO, NOBUTAKA |
description | An evacuation method used for a vacuum processing apparatus including a vacuum processing chamber is provided. The vacuum processing chamber is evacuated by an exhaust device for a first predetermined period of time by opening a valve connecting the exhaust device with the vacuum processing chamber. A pressure in the vacuum processing chamber is urged to increase by closing the valve and leaving the valve closed for a second predetermined period of time after evacuating the vacuum processing chamber. Evacuating the vacuum processing chamber and urging the pressure in the vacuum processing chamber to increase are performed so as to reduce the pressure in the vacuum processing chamber to a pressure between 6.7 Pa and 13.3×102 Pa (between 5 Torr and 10 Torr) without freezing moisture in the vacuum processing chamber. |
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The vacuum processing chamber is evacuated by an exhaust device for a first predetermined period of time by opening a valve connecting the exhaust device with the vacuum processing chamber. A pressure in the vacuum processing chamber is urged to increase by closing the valve and leaving the valve closed for a second predetermined period of time after evacuating the vacuum processing chamber. Evacuating the vacuum processing chamber and urging the pressure in the vacuum processing chamber to increase are performed so as to reduce the pressure in the vacuum processing chamber to a pressure between 6.7 Pa and 13.3×102 Pa (between 5 Torr and 10 Torr) without freezing moisture in the vacuum processing chamber.</description><language>chi</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191101&DB=EPODOC&CC=TW&NR=I676222B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191101&DB=EPODOC&CC=TW&NR=I676222B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAKUSHIJI, HIDEAKI</creatorcontrib><creatorcontrib>HAGA, HIROFUMI</creatorcontrib><creatorcontrib>NAKAO, NOBUTAKA</creatorcontrib><title>TWI676222B</title><description>An evacuation method used for a vacuum processing apparatus including a vacuum processing chamber is provided. The vacuum processing chamber is evacuated by an exhaust device for a first predetermined period of time by opening a valve connecting the exhaust device with the vacuum processing chamber. A pressure in the vacuum processing chamber is urged to increase by closing the valve and leaving the valve closed for a second predetermined period of time after evacuating the vacuum processing chamber. Evacuating the vacuum processing chamber and urging the pressure in the vacuum processing chamber to increase are performed so as to reduce the pressure in the vacuum processing chamber to a pressure between 6.7 Pa and 13.3×102 Pa (between 5 Torr and 10 Torr) without freezing moisture in the vacuum processing chamber.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0MzczMjJy4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACb4bfA</recordid><startdate>20191101</startdate><enddate>20191101</enddate><creator>YAKUSHIJI, HIDEAKI</creator><creator>HAGA, HIROFUMI</creator><creator>NAKAO, NOBUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20191101</creationdate><title>TWI676222B</title><author>YAKUSHIJI, HIDEAKI ; HAGA, HIROFUMI ; NAKAO, NOBUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI676222BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YAKUSHIJI, HIDEAKI</creatorcontrib><creatorcontrib>HAGA, HIROFUMI</creatorcontrib><creatorcontrib>NAKAO, NOBUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAKUSHIJI, HIDEAKI</au><au>HAGA, HIROFUMI</au><au>NAKAO, NOBUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI676222B</title><date>2019-11-01</date><risdate>2019</risdate><abstract>An evacuation method used for a vacuum processing apparatus including a vacuum processing chamber is provided. The vacuum processing chamber is evacuated by an exhaust device for a first predetermined period of time by opening a valve connecting the exhaust device with the vacuum processing chamber. A pressure in the vacuum processing chamber is urged to increase by closing the valve and leaving the valve closed for a second predetermined period of time after evacuating the vacuum processing chamber. Evacuating the vacuum processing chamber and urging the pressure in the vacuum processing chamber to increase are performed so as to reduce the pressure in the vacuum processing chamber to a pressure between 6.7 Pa and 13.3×102 Pa (between 5 Torr and 10 Torr) without freezing moisture in the vacuum processing chamber.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | TWI676222B |
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