Small size, weight, and packaging of image sensors

A method and structure of an image sensor device including a read out integrated circuit (ROIC) and a photodiode array (PDA). An embodiment may include a package substrate having a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHILINSKY, DMITRY, TAGLE, JOHN, LILAND, MICHAEL A. JR
Format: Patent
Sprache:chi ; eng
Schlagworte:
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