Semiconductor package and method of forming the same

A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a seco...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU, WEING, LEE, MENG-TSAN, CHIU, CHIENIA, WANG, CHIN-TE, LIN, TSUNG-SHU, CHEN, HSIEN-WEI, YU, CHEN-HUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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