Wafer processing system with chuck assembly maintenance module

Wafer processing system with chuck assembly maintenance module

A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaf...

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Hauptverfasser: HARRIS, RANDY A, FRANCISCHETTI, VINCENT STEFFAN, SUNDAR, SATISH, PUCH, BRYAN, RYE, JASON, SILVETTI, MARIO DAVID
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HARRIS, RANDY A
FRANCISCHETTI, VINCENT STEFFAN
SUNDAR, SATISH
PUCH, BRYAN
RYE, JASON
SILVETTI, MARIO DAVID
description A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Wafer processing system with chuck assembly maintenance module
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