TWI655744B

TWI655744B

The present invention provides a method to manufacture a stacked device, capable of easily removing a support wafer from a wafer. According to the present invention, a support wafer temporarily bonded on a surface of a first device wafer by a temporary adhesive material is made of a silicon wafer. W...

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Hauptverfasser: MAEDA, NOBUHIDE, KAWAI, AKIHITO, KODAMA, SHOICHI, KIM, YOUNGSUK
Format: Patent
Sprache:chi
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MAEDA, NOBUHIDE
KAWAI, AKIHITO
KODAMA, SHOICHI
KIM, YOUNGSUK
description The present invention provides a method to manufacture a stacked device, capable of easily removing a support wafer from a wafer. According to the present invention, a support wafer temporarily bonded on a surface of a first device wafer by a temporary adhesive material is made of a silicon wafer. When the temporary adhesive material is exposed by performing a temporary adhesive material exposure process after a bonded wafer formation process, the support wafer is removed by at least polishing without heating the temporary adhesive material, so it is easily removed from the first device wafer, and thereby dislocation between the stacked first and second device wafer is not generated. A temporary adhesive material removing process is performed after the temporary adhesive exposure process, so the temporary adhesive material is removed from a device of the first device wafer, and thereby removal of the temporary adhesive material and cleaning of the device can be performed at the same time.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title TWI655744B
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