HOST COMPUTER SYSTEM AND HEAT DISSIPATION APPARATUS AND SEPARATION MECHANISM THEREOF

A heat dissipation apparatus, adaptable to at least one first circuit device and at least one second circuit device, includes a chassis; and at least one separation mechanism disposed in the chassis, the first circuit device and the second circuit device being respectively disposed at two sides of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, PIN-JEN, CHEN, CHIEN-AN, LU, MING-HSIEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!